3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 Ambiguities and uncertainties regarding surface

Ambiguities and uncertainties regarding surface defects may be resolved by reference to this Guide

本ガイドラインに概説した手順を実行することは，ガスもしくは制御用ガスのモニタと制御に使われ，潜在的に危険なマスフローデバイスを，輸送および/もしくは受入れ時に関係したリスクを，減らすためのテクニックを与える。

These specifications cover substrate requirements for monocrystalline high-purity silicon carbide wafers of crystallographic polytype 6H and 4H used in semiconductor and electronic device manufacturing

they are out of scope of this specification

This Specification covers virgin test wafers in all standard wafer diameters from 2 inch to 300 mm

3D02200 - SEMI 3D23 - Specification for Glass Carrier Characteristics for Panel Level Packaging (PLP) Applications StdPbc-0721 Ambiguities and uncertainties regarding surfaceThe purpose of this Specification is to establish basic physical dimensions for the glass carrier intended to be used for panel level package processing. This Specification specifies physical dimensions of the glass carrier for use in panel level packaging (PLP) applications.<br><br>This Specification describes glass carrier with 510 mm 515 mm and 600 mm 600 mm panel sizes as specified by the relevant SEMI 3D20. Referenced SEMI Standards (purchase