G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI E62-0302AE (editorial revision)

SEMI E62-0302AE (editorial revision)

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This Standard defines three methods for testing chemical durability of various flat panel display substrates: (Method A) Weight Loss

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The XML Messaging Specification provides definitions of message headers needed for messages exchanged in an asynchronous or synchronous fashion

G01400 - SEMI G14 - Guideline for Specifying the Dimensions and Tolerances Used to Manufacture Plastic Molded Dip Package Tooling Revision:SEMI G14-88 - Inactive SEMI E62-0302AE (editorial revision)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Document is a guideline for the ordering of tooling required to mold and form plastic molded DIP semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line tool makers as the