G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly StdTpc-Stainless Steel Components · プロセスカセットまたはクォーツボートとプロセスチェンバーの底面との間

·        プロセスカセットまたはクォーツボートとプロセスチェンバーの底面との間

SEMI E30-0303 (technical revision)

and microfluidic devices including valves and pumps

process flows

SEMI T3-0697E (editorial revision)

G05300 - SEMI G53 - Specification for Metal Lid/Preform Assembly StdTpc-Stainless Steel Components · プロセスカセットまたはクォーツボートとプロセスチェンバーの底面との間This specification provides guidelines for the design and acceptance of metal lid preform assemblies. This specification may be used by suppliers at outgoing inspection and by the customers at incoming inspection. The design and acceptance criteria may be used for metal lid preform assemblies used on all types of semiconductor packages. Improper lid preform design and poorly specified lid preforms contributes to low sealing yields and unreliable