G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits StdPbc-0616 a piece of equipment can

a piece of equipment can be seen as a mechanical entity in the factory which plays a role in the manufacturing process

SEMI E16-90 (Reapproved 0699)

SEMI M66-0706E (editorial revision)

The following areas are to be addressed in this Document:

It also provides guidelines for specifying other code locations when the suggested location is not suitable for an application

G04600 - SEMI G46 - Test Method for Thermal Transient Testing for Die Attachment Evaluation of Integrated Circuits StdPbc-0616 a piece of equipment canEvaluation of semiconductor die attachment integrity using the thermal transient techniques as implemented by the Electrical Test Method on either thermal test chips or active devices. Steady state thermal response (or thermal resistance) and thermal transient response of discrete semiconductor devices and integrated circuits are sensitive to the presence of voids in the die attachment material between the semiconductor chip and package. These voids