MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current SEMI P38 — Specification for

SEMI P38 — Specification for Absorbing Film Stacks and Multilayers on Extreme Ultraviolet Lithography Mask Blanks

This Practice covers a methodology to determine the costs associated with misclassification of product due to variability and bias of measurement equipment

20 for devices of 100 volt human body model [HBM] sensitivity) so the guidance given here should be applied only within a specially designated and clearly identified area

·    Film deposition equipment (CVD & PVD)

The second purpose of this Specification and Guide is to provide a guide for a higher purity Tier of hydrogen peroxide for which a need has been identified

MS01200 - SEMI MS12 - Specification for Silicon Substrates Used in Fabrication of MEMS Devices Revision:SEMI MS12-0220 (Reapproved 1125) - Current SEMI P38 — Specification for1 Purpose 1. 1 Although the substrates used in the production of MEMS share many physical and electrical properties with those used in IC manufacturing there are some significant differences as well. There exists a need to standardize MEMS substrates to allow the stocking of standard material, lowering the time to purchase, time to market and overall cost. This specification provides the necessary information for ordering and specifying such