G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E22-0697 (Reapproved 0309)

SEMI E22-0697 (Reapproved 0309)

This Standard describes a Guide for analysis of virgin high-purity ion exchange (HPIX) resin suitable for use in ultrapure water (UPW) polish applications

Control of parameters such as bonded wafer stack (BWS) thickness

SEMI D34-0710 (technical revision)

E本スタンダードは2006年5月に編集上の修正がなされた。修正箇所は，¶10

G09700 - SEMI G97 - Specification for Adhesive Tray Used for Thin Chip Handling Revision:SEMI G97-0116 - Superseded SEMI E22-0697 (Reapproved 0309)NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard describes procedures for measuring the mechanical, physical, chemical, thermal, and electrical properties of leadframe tape. Equipment, sampling, and procedures are referred to in the individual test methods.