G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title and employees must be trained

and employees must be trained

This Standard is applicable to backlight units

This edition was approved for publication by the global Audits and Reviews Subcommittee on December 24

The pellicle exclusion volume of this Specification accommodates pellicles which extend the full length of the reticle and up to a maximum pellicle width of 124 mm

このスタンダードはコンセプトおよび挙動からメッセージサービスまでの解決策を提示している。メッセージ送受信プロトコルは定義していない。

G05000 - SEMI G50 - Specification for Co-Fired Ceramic Fine Pitch Leaded and Leadless Chip Carrier Package Constructions Revision:Default Title and employees must be trainedThis specification defines the standard requirements for co fired ceramic fine pitch chip carrier constructions, including both top brazed leaded and top metallized leadless configurations. These constructions are for hermetic packaging of various devices, (e. g., high speed, digital VLSI silicon devices), and next level interconnection to printed wiring assemblies and modules by either lead solder attachment or by "leads last" techniques. Referenced