G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending StdPbc-0818 HSMS is intended as an

HSMS is intended as an alternative to SEMI E4 (SECS-I) for applications where higher speed communication is needed or when a simple point-to-point topology is insufficient

SEMI D60-0818 (technical revision)

SEMI M13 — Specification for Alphanumeric Marking of Silicon Wafers

SEMI E4-91 (technical revision)

SEMI MF1530-02 (first SEMI publication)

G09600 - SEMI G96 - Test Method for Measurement of Chip (Die) Strength by Mean of Cantilever Bending StdPbc-0818 HSMS is intended as an* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1