M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn SEMI E39 — Object Services

SEMI E39 — Object Services Standard (OSS)

This document describes standard behaviors for automated transfer of substrates among automated material handling systems (AMHS) and equipment at FPD fabs

which provides uniform illumination of the specimen

however the definitions used are subject to interpretation

orgで，そして2009年3月にCD-ROMで入手可能となる。初版は2002年11月に発行された。

M02200 - SEMI M22 - Specification for Dielectrically Isolated (DI) Wafers Revision:SEMI M22-0303 (Withdrawn 0307) - Withdrawn SEMI E39 — Object ServicesThis standard was technically approved by the global Silicon Wafer Committee. This edition was approved for publication by the global Audits & Reviews Subcommittee on November 21, 2006. It was available at www. semi. org in February 2007. Originally published in 1992; previously published March 2003. NOTICE: This document was balloted and approved for withdrawal in 2007. Dielectrically isolated (DI) wafers are used for fabricating specialized