G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications although the test procedure may

although the test procedure may prove useful in corrosion studies

and dimensions of the components

SEMI E10-86 (first published)

which provides a unified standard for the manufacture

but it is not expected to be material dependent

G10300 - SEMI G103 - Specification for Viscosity of Encapsulation Materials for Wafer Level Packaging and Panel Level Packaging StdTpc-Chemical & Gas General Specifications although the test procedure mayMold resin material characteristics are specified for legacy packages such as leaded and ball grid array packages, but there is no specification for encapsulation characteristics for wafer level packaging (WLP) and panel level packaging (PLP). Three different types of encapsulations such as liquid, granular and sheet material are used for WLP and PLP and these requires the different characteristics and performances. The characteristics of