G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title NOTICE: This Document was completely

NOTICE: This Document was completely rewritten in 2008

SEMI E126-0305 (technical revision)

SEMI 3D7-0913 (first published)

Topic & Readings

2-0316 (Reapproved 0124)

G03700 - SEMI G37 - Specification for Dimensions and Tolerances Used to Manufacture Plastic Molded Small Outline Package Tooling Revision:Default Title NOTICE: This Document was completelyThis document is a guideline for the ordering of tooling required to mold and form plastic molded small outline semiconductor packages. It is to be used by packaging engineers, mold manufacturers, and end of line toolmakers as the basis for defining the limits of manufacturing tolerances. Referenced SEMI Standards None.