E19300 - SEMI E193 - Specification for 300 mm Film Frame FOUP (FFF) volume-C This Document will specify methods

This Document will specify methods

This Test Method describes procedures for characterizing silicon wafers to determine gate oxide integrity (GOI)

This standard specifies selected requirements of the cassettes used to ship flat panel substrates from the substrate finisher to the display maker and between process-added users

Many requirements given in this Specification are in the form of maximum or minimum dimensions with very few required surfaces

目的 ―　本仕様は，ベース，ウィンドウ・フレーム，キャップおよび封止ガラス材料を含んだCerquadパッケージ部品用の受諾規準を定義するものである。

E19300 - SEMI E193 - Specification for 300 mm Film Frame FOUP (FFF) volume-C This Document will specify methodsNOTICE: This Standard does not follow normal formatting rules; it is being published with colored text in Table 1, 10. 4. 1, 10. 4. 1. 2, 10. 4. 1. 3, and Table 2. 1 Purpose 1. 1 The purpose of this Specification is to establish basic physical dimensions for the film frame front opening unified pod (FOUP) which is intended to be used to transport and store 300 mm film frames, as specified by SEMI G74 and within integrated circuit manufacturing