Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle100D05C2opt Mixing Jars Tired of grinding by hand

Tired of grinding by hand

Test Reports and Curves for analysis

For milling the oxide material

The software (ExtremeTest) is included to set various working modes for measuring capacity and life cycle for all types of rechargeable batteries

Multiple battery analyzers can be connected to 1 PC via an ethernet switch ($100

Corning EAGLE XG wafer 100mm dia x 0.5mm, 2 sp surface quality 60/40 - CorningEagle100D05C2opt Mixing Jars Tired of grinding by handFeatures: Corning EAGLE XG Glass Substrates Suggested Max. Use Temperature: 675 deg C (1,247 deg F ) Dimension: 100 mm (+ 0. 2mm) in diameter x 0. 5 mm(+ 0. 05mm) High transmission (75 80 %) Low defect densities Low ohmic values Both Sides Optically Clear with Surface Quality; 60 40 and Surface Roughness Ra: < 0. 5 nm RMS Edge : CNC ground Non effective area: 3. 0mm Border Highly transparent LCD and OLED applications For the properties of Corning