Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 Fuel production industries

Fuel production industries

Electrical safety of appliances and immunity to electromagnetic phenomena

it is not applicable to commercial or work boats used in severe conditions

track circuit signalling systems

This European Standard relates to the immunity requirements of equipment

Semiconductor devices. Micro-electromechanical devices - Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures Ingestion-build-84997 Fuel production industries1 Scope This part of IEC 62047 specifies a method for bending fatigue testing using resonant vibration of microscale mechanical structures of MEMS (micro electromechanical systems) and micromachines. This standard applies to vibrating structures ranging in size from 10 m to 1 000 m in the plane direction and from 1 m to 100 m in thickness, and test materials measuring under 1 mm in length, under 1 mm in width, and between 0,1 m and 10 m in thickness.