Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100>"> Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100>"> Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100>"> GaP wafer, S doped, (111) orientation, 2" dia x 0.45mm, 1sp Fuse 2500 ~ 3500 – mrscleanmckinney.com

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GaP wafer, S doped, (111) orientation, 2" dia x 0.45mm, 1sp Fuse 2500 ~ 3500

$327.18

Quantity
Description

2500 ~ 3500

Built-in PTFE slurry slot with 180mm coating width to make coating material evenly distributed ahead of the blade

you must check the substrate by XRD before growing the film

FKM is also suitable for high vacuum applications

LiCoO2 (LCO) electrode sheet

GaP wafer, S doped, (111) orientation, 2" dia x 0.45mm, 1sp Fuse 2500 ~ 3500GaP single crystal wafer, Size: 2" diameter(0. 15mm) x 0. 45mm(0. 05mm), Doping: S doped, Conducting type: N type, Orientation: (111)30' Edge Orientation: (110)1 Polished: One side polished. Surface finish (RMS or Ra) : < 8A Typical Physical Properties Crystal Structure Cubic. a =5. 4505 ? FONT> Growth Method CZ (LEC) Density 4. 13 g cm3 Melt Point 1480 oC Thermal Expansion 5. 3 x10 6 oC Dopant S doped undoped Crystal growth axis <111> or <100> <100>

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