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Al2O3- Sapphire Wafer, C-plane (0001),10x10x1mm, 2 SP - ALC101010S2 Nano The fully diamond sintered blade
Al2O3- Sapphire Wafer, C-plane (0001),10x10x1mm, 2 SP - ALC101010S2 Nano The fully diamond sintered blade
$45.94
Description
The fully diamond sintered blade is suitable for low speed cutting ( under 3000 RPM) of oxide single crystals or any brittle crystal
which can be removed by 600C sintering
Material LiCoO2 Coated on Aluminum Foil
Diameter: 100mm+/-0
Net weight: 8
Al2O3- Sapphire Wafer, C-plane (0001),10x10x1mm, 2 SP - ALC101010S2 Nano The fully diamond sintered bladeFeatures: Sapphire substrate is the popular substrates for III V nitrides, superconductor and magnetic epi film due to less mis matched lattice and stable chemical and physical properties. Wafer size: 10 x 10 x 1 mm thick Orientation: <0001> + 0. 5o Polished surface: Substrate surface is EPI polished via a special CMP procedure with RA < 5 A 2 sides polished Package: Each wafer is packed in 1000 class clean room with 100 grade plastic bag with wafer
Shipping Notes
- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
- If time is of the essence, please consider selecting expedited delivery for faster service.
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