MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded SEMI G4-89 (technical revision)

SEMI G4-89 (technical revision)

It should be noted that the following list of criteria was considered when determining the specified analytical method

The purpose of this document is to provide a specification for dichlorosilane (SiH2Cl2) used in the semiconductor industry

and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities

except that it uses special wafer holding fixtures to orient the wafer uniquely with respect to the X-ray goniometer

MS00100 - SEMI MS1 - Guide to Specifying Wafer-Wafer Bonding Alignment Targets Revision:SEMI MS1-0307 (Reapproved 0318) - Superseded SEMI G4-89 (technical revision)1 Purpose 1. 1 This Guide provides a framework for specifying the dimensions, location, quantity and characteristics of alignment targets that are placed on each wafer of a pair of wafers. Such targets are used to align two patterned wafers prior to an operation that bonds them together. 2 Scope 2. 1 This Guide applies to targets that can be used with two common alignment processesinner surface alignment and outer surface alignment. 2. 2 This Guide