Al2O3- Sapphire Wafer, R Plane, 10x10x0.5mm, 1SP - ALR101005S1 Orientation 110 and report immediately to carrier/MTI

and report immediately to carrier/MTI

Panel cutout:

The Alumina cutting blade fits with MTI SYJ-150 low speed saw or other brand of low speed saw

it is necessary to use dry or alcohol-based tool lubricant to lubricate the die and sleeve set to reduce friction during the compression

Laminate strength

Al2O3- Sapphire Wafer, R Plane, 10x10x0.5mm, 1SP - ALR101005S1 Orientation 110 and report immediately to carrier/MTIFeatures: Sapphire substrate is the popular substrates for III V nitrides, superconductor and magnetic epi film due to less mis matched lattice and stable chemical and physical properties Wafer size: 10 mm x 10 mm x 0. 5 mm thick Orientation tolerance: <1 102> + 0. 5 o Polished surface: Substrate surface is EPI polished via a special CMP procedure with RA < 5 A 1 side polished Package: Each wafer is packed in 1000 class clean room with 100 grade