US$ 124.95
BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Laser Mark: none
$744.62
Description
Laser Mark: none
and one of the advantage from water-based (Aqueous) chemistry is it isn't prone to catching fire
Tungsten Carbide Milling Ball
600 lbs loading
Hydraulic Pressure in Chamber 300 Mpa ( 43500 PSI) Hydraulic Machine optional
BiFeO3 Target > 99.99%, 3" Dia x 0.125" Thick bond to Copper(Cu) backing plate(0.111" thick) Storage Chambers/Fume Hoods Laser Mark: noneComposition: Bismuth Iron Oxide BiFeO3 Target 3" Dia x 0. 125" Thick bond to Copper(Cu) backing plate(0. 111" thick) Purity: > 99. 99% Related Products Target A Z Crystal wafer A Z Plasma Cleaner Wafer Containers Dicing saw Film Coater
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